CB-ACC-36【PDF 36/58 页】ANTENNA 1/2WV 2.4GHZ 10CM RPSMA

Version 1.17 2011-09

5.3 Using Press-Fit Nuts for Mounting the Module

A press-fit nut is pressed into the PCB from the bottom side with a special press tool. M2

sized press-fit nuts are suitable for the modules (see Figure 7 and Figure 8) and are manu-

factured by PEM Fastening Systems (www.pemnet.com), part no KFS2-M2 (see Figure 9).

Be careful with the distance between the nuts regarding alignment, see section 5.1.2.

Figure 9: KFS2-M2 press-fit nut.

Spacer-pipes are recommended to use between the PCBs when press-fit nuts are used.

5.4 Using the J6 PCB solder pads on the edge

5.4.1 Host PCB

The host PCB footprint should not contain any traces or vias under the module except the

pads interfacing the J6 pads to avoid contact with traces/vias on the module. The host pads

which are soldered to the J6 pads should reach 0.5-1.0mm under the PCB and some mm

outside the module. No other pads than the J6 should be soldered to the host PCB. See sec-

tion 2.1.1 for more info about the J6 pads.

5.4.2 Mounting process

" We strongly recommend the modules not being soldered more than 1 time after

shipping from connectBlue and that the modules are mounted just before the host

product is being soldered the last time. Although, connectBlue devices will withstand

up to two reflows to an absolute maximum temperature of 250癈.

" The PCB in our modules is made of FR4-type with Chemical Gold Pads.

" The modules are produced in a lead-free process with a lead-free soldering paste.

" It is recommended that the customers make their own electrical, climate, stress and

vibration tests on the final assembled product to secure that the manufacturing pro-

cess hasn't damaged or affected the Bluetooth module in any way.

" The modules can be delivered on trays or individually packed in ESD bags with label

on each module. The label will not withstand the heat of soldering and should be

removed before processed. The modules delivered in trays will not have individual

label (only batch labels on the tray).

" Modules delivered on trays are classed with MSL-Class 3.

" The device recommended maximum reflow temperature is 245癈 for 10 sec.

" The device absolute maximum reflow temperature is 250癈 for 3 sec.

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